Mitul Modi — 5 Patents at Intel

Issued Patents 2025

Showing 1–5 of 5 patents

Patent #	Title	Co-Inventors	Date
12476174	Ultra-thin, hyper-density semiconductor packages	Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Sanka Ganesan, Rajasekaran Swaminathan +4 more	2025-11-18
12422615	Nested glass packaging architecture for hybrid electrical and optical communication devices	Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more	2025-09-23
12406914	Ultra-thin, hyper-density semiconductor packages	Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Sanka Ganesan, Rajasekaran Swaminathan +4 more	2025-09-02
12392970	Photonic integrated circuit packaging architectures	Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan, Srinivas V. Pietambaram +1 more	2025-08-19
12261150	Mold shelf package design and process flow for advanced package architectures	Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal	2025-03-25