Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388019 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan | 2025-08-12 |
| 12347783 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2025-07-01 |
| 12283535 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2025-04-22 |
| 12261150 | Mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi | 2025-03-25 |