Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more | 2025-09-23 |
| 12392970 | Photonic integrated circuit packaging architectures | Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan, Srinivas V. Pietambaram +1 more | 2025-08-19 |
| 12388019 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Rajasekaran Swaminathan, Ram Viswanath | 2025-08-12 |
| 12347782 | Microelectronic assemblies with direct attach to circuit boards | Sanka Ganesan, William J. Lambert, Xavier Francois Brun | 2025-07-01 |
| 12327797 | Microelectronic structures including glass cores | Srinivas V. Pietambaram, Tarek A. Ibrahim, Gang Duan, Sai Vadlamani | 2025-06-10 |
| 12272656 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram | 2025-04-08 |
| 12199048 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram | 2025-01-14 |