Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12368089 | Low cost embedded integrated circuit dies | Sanka Ganesan | 2025-07-22 |
| 12347782 | Microelectronic assemblies with direct attach to circuit boards | Sanka Ganesan, William J. Lambert, Bharat P. Penmecha | 2025-07-01 |
| 12341080 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Pooya Tadayon | 2025-06-24 |