Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12411939 | Vertically integrated automatic threat level determination for containers and hosts in a containerization environment | Henrik Rosendahl, Fei Huang | 2025-09-09 |
| 12400363 | Device and method for improved fiducial marker detection | Yi Li, Hong Seung YEON, Nicholas S. Haehn, Wei Li, Raquel DE SOUZA BORGES FERREIRA +4 more | 2025-08-26 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Leonel Arana +1 more | 2025-07-08 |
| 12327797 | Microelectronic structures including glass cores | Srinivas V. Pietambaram, Tarek A. Ibrahim, Sai Vadlamani, Bharat P. Penmecha | 2025-06-10 |
| 12308329 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2025-05-20 |
| 12244625 | Application layer data protection for containers in a containerization environment | Fei Huang, Zang Li | 2025-03-04 |
| 12230430 | Substrate embedded magnetic core inductors and method of making | Srinivas V. Pietambaram, Kristof Darmawikarta, Yonggang Li, Sameer Paital | 2025-02-18 |
| 12191240 | Hybrid glass core for wafer level and panel level packaging applications | Jieying Kong, Srinivas V. Pietambaram | 2025-01-07 |