Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Leonel Arana, Robert Alan May +1 more | 2025-07-08 |
| 12345932 | Die last and waveguide last architecture for silicon photonic packaging | Bai Nie, Pooya Tadayon, Leonel Arana, Yonggang Li, Kristof Darmawikarta +4 more | 2025-07-01 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more | 2025-06-24 |
| 12298572 | Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure | Pooya Tadayon, Zhichao Zhang, Liang Zhang, Srikant Nekkanty | 2025-05-13 |