Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Leonel Arana +1 more | 2025-07-08 |
| 12354963 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2025-07-08 |
| 12334443 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2025-06-17 |
| 12300613 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2025-05-13 |
| 12253722 | Magneto-optical Kerr effect interconnects for photonic packaging | Hiroki Tanaka, Kristof Darmawikarta, Brandon C. Marin, Sri Ranga Sai Boyapati | 2025-03-18 |
| 12218069 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2025-02-04 |
| 12218071 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2025-02-04 |