Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218071 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Kwangmo Chris Lim | 2025-02-04 |
| 12199067 | Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same | Adel A. Elsherbini, Henning Braunisch, Shawna M. Liff | 2025-01-14 |