| 12416093 |
Electroless plating process |
Chandrasekharan Nair, Darko Grujicic, Rengarajan Shanmugam, Srinivasan Raman, Roy Dittler +3 more |
2025-09-16 |
| 12341117 |
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates |
Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more |
2025-06-24 |
| 12327773 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2025-06-10 |
| 12308329 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo |
2025-05-20 |
| 12300620 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman |
2025-05-13 |
| 12243825 |
Hybrid conductive vias for electronic substrates |
Srinivas V. Pietambaram |
2025-03-04 |
| 12218040 |
Nested interposer with through-silicon via bridge die |
Srinivas V. Pietambaram, Debendra Mallik, Kristof Darmawikarta, Ravindranath V. Mahajan |
2025-02-04 |