Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341129 | Substrateless double-sided embedded multi-die interconnect bridge | Biancun Xie, Sujit Sharan, Debendra Mallik, Robert L. Sankman | 2025-06-24 |
| 12218063 | EMIB architecture with dedicated metal layers for improving power delivery | Sujit Sharan, Huang-Ta Chen | 2025-02-04 |
| 12205924 | Semiconductor packages with chiplets coupled to a memory device | Andrew Collins | 2025-01-21 |