Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2025-09-02 |
| 12400952 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Debendra Mallik | 2025-08-26 |
| 12336196 | Magnetic core inductors on package substrates | Krishna Bharath, Wei-Lun Kane Jen, Huong Do | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2025-06-10 |
| 12272650 | Microelectronic package with substrate cavity for bridge-attach | Omkar G. Karhade, Debendra Mallik, Nitin A. Deshpande | 2025-04-08 |