Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400952 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik | 2025-08-26 |
| 12349276 | Co-planar interconnection mechanisms for circuit boards | Mooi Ling Chang, Tin Poay Chuah, Min Suet Lim, Twan Sing Loo | 2025-07-01 |
| 12341121 | Through-substrate underfill formation for an integrated circuit assembly | Kyle Robert Davidson, Min Suet Lim, Kevin Byrd, James A. Wade | 2025-06-24 |