Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341121 | Through-substrate underfill formation for an integrated circuit assembly | Eng Huat Goh, Kyle Robert Davidson, Min Suet Lim, James A. Wade | 2025-06-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341121 | Through-substrate underfill formation for an integrated circuit assembly | Eng Huat Goh, Kyle Robert Davidson, Min Suet Lim, James A. Wade | 2025-06-24 |