Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424779 | Flexible printed circuit board arrangement | Jeff Ku, Yew San Lim, Boon Ping Koh, Min Suet Lim | 2025-09-23 |
| 12406916 | Via plug capacitor | Santosh Gangal | 2025-09-02 |
| 12349276 | Co-planar interconnection mechanisms for circuit boards | Mooi Ling Chang, Eng Huat Goh, Min Suet Lim, Twan Sing Loo | 2025-07-01 |
| 12328816 | Asymmetrical laminated circuit boards for improved electrical performance | Jackson Chung Peng Kong, Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim | 2025-06-10 |
| 12309984 | Radiation shield and groove in support structure | Boon Ping Koh, Twan Sing Loo, Yew San Lim | 2025-05-20 |
| 12256487 | Hybrid boards with embedded planes | Jackson Chung Peng Kong, Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Chin Lee Kuan | 2025-03-18 |
| 12250800 | Radiation shield with zipper | Yew San Lim, Jeff Ku, Boon Ping Koh, Min Suet Lim | 2025-03-11 |
| 12218042 | Via plug resistor | Santosh Gangal | 2025-02-04 |