Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412784 | Recessed vertical interconnects for device miniaturization | Yee Lun Ong, Teong Guan Yew, Jackson Chung Peng Kong | 2025-09-09 |
| 12328816 | Asymmetrical laminated circuit boards for improved electrical performance | Jackson Chung Peng Kong, Tin Poay Chuah, Jenny Shio Yin Ong, Seok Ling Lim | 2025-06-10 |
| 12288740 | Semiconductor package with hybrid mold layers | Chia-Chuan Wu, Jackson Chung Peng Kong, Kooi Chi Ooi | 2025-04-29 |
| 12256487 | Hybrid boards with embedded planes | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim, Chin Lee Kuan, Tin Poay Chuah | 2025-03-18 |
| 12218064 | Molded silicon interconnects in bridges for integrated-circuit packages | Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2025-02-04 |
| 12191281 | Multi-chip package with recessed memory | Yang Liang Poh, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2025-01-07 |