Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288740 | Semiconductor package with hybrid mold layers | Bok Eng Cheah, Chia-Chuan Wu, Jackson Chung Peng Kong | 2025-04-29 |
| 12218064 | Molded silicon interconnects in bridges for integrated-circuit packages | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong | 2025-02-04 |