Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12328816 | Asymmetrical laminated circuit boards for improved electrical performance | Jackson Chung Peng Kong, Bok Eng Cheah, Tin Poay Chuah, Seok Ling Lim | 2025-06-10 |
| 12256487 | Hybrid boards with embedded planes | Jackson Chung Peng Kong, Bok Eng Cheah, Seok Ling Lim, Chin Lee Kuan, Tin Poay Chuah | 2025-03-18 |
| 12218064 | Molded silicon interconnects in bridges for integrated-circuit packages | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2025-02-04 |
| 12191281 | Multi-chip package with recessed memory | Bok Eng Cheah, Yang Liang Poh, Seok Ling Lim, Jackson Chung Peng Kong | 2025-01-07 |