Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191281 | Multi-chip package with recessed memory | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2025-01-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191281 | Multi-chip package with recessed memory | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2025-01-07 |