Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400952 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2025-08-26 |