Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309966 | Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force | Jin Yang, Mengqi Liu, Phil Geng, Ralph V. Miele, Sandeep Ahuja +1 more | 2025-05-20 |
| 12293956 | Boiling enhancement structures for immersion cooled electronic systems | Jin Yang, Xicai Jing, Yuan-Liang Li, Yuyang XIA, David Shia +9 more | 2025-05-06 |
| 12248344 | Technologies for liquid cooling interfaces | Kristin L. Weldon, David Rodriguez, Jin Yang, David Shia, Mohanraj Prabhugoud +1 more | 2025-03-11 |