Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315780 | Technologies for processor loading mechanisms | Ralph V. Miele, Phil Geng, David Shia, Sandeep Ahuja, Eric W. Buddrius +1 more | 2025-05-27 |
| 12309966 | Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force | Jin Yang, Jimmy Chuang, Phil Geng, Ralph V. Miele, Sandeep Ahuja +1 more | 2025-05-20 |
| 12279395 | Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention | Phil Geng, Ralph V. Miele, David Shia, Jeffory L. Smalley, Eric W. Buddrius +2 more | 2025-04-15 |