Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315780 | Technologies for processor loading mechanisms | Ralph V. Miele, Phil Geng, Mengqi Liu, David Shia, Sandeep Ahuja +1 more | 2025-05-27 |
| 12309933 | Magnetically secured semiconductor chip package loading assembly | Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian +2 more | 2025-05-20 |
| 12279395 | Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention | Phil Geng, Ralph V. Miele, David Shia, Eric W. Buddrius, Sean T. Sivapalan +2 more | 2025-04-15 |