Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315780 | Technologies for processor loading mechanisms | Ralph V. Miele, Phil Geng, Mengqi Liu, Sandeep Ahuja, Eric W. Buddrius +1 more | 2025-05-27 |
| 12309966 | Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force | Jin Yang, Jimmy Chuang, Mengqi Liu, Phil Geng, Ralph V. Miele +1 more | 2025-05-20 |
| 12309933 | Magnetically secured semiconductor chip package loading assembly | Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian +2 more | 2025-05-20 |
| 12293956 | Boiling enhancement structures for immersion cooled electronic systems | Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more | 2025-05-06 |
| 12279395 | Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention | Phil Geng, Ralph V. Miele, Jeffory L. Smalley, Eric W. Buddrius, Sean T. Sivapalan +2 more | 2025-04-15 |
| 12262478 | Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems | Jin Yang | 2025-03-25 |
| 12248344 | Technologies for liquid cooling interfaces | Kristin L. Weldon, David Rodriguez, Jin Yang, Jimmy Chuang, Mohanraj Prabhugoud +1 more | 2025-03-11 |