| 12315780 |
Technologies for processor loading mechanisms |
Ralph V. Miele, Phil Geng, Mengqi Liu, Sandeep Ahuja, Eric W. Buddrius +1 more |
2025-05-27 |
| 12309966 |
Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force |
Jin Yang, Jimmy Chuang, Mengqi Liu, Phil Geng, Ralph V. Miele +1 more |
2025-05-20 |
| 12309933 |
Magnetically secured semiconductor chip package loading assembly |
Phil Geng, Timothy Glen Hanna, Xiaoning Ye, Sandeep Ahuja, Jacob McMillian +2 more |
2025-05-20 |
| 12293956 |
Boiling enhancement structures for immersion cooled electronic systems |
Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more |
2025-05-06 |
| 12279395 |
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention |
Phil Geng, Ralph V. Miele, Jeffory L. Smalley, Eric W. Buddrius, Sean T. Sivapalan +2 more |
2025-04-15 |
| 12262478 |
Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems |
Jin Yang |
2025-03-25 |
| 12248344 |
Technologies for liquid cooling interfaces |
Kristin L. Weldon, David Rodriguez, Jin Yang, Jimmy Chuang, Mohanraj Prabhugoud +1 more |
2025-03-11 |