Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327801 | Robust mold integrated substrate | Kyle Yazzie, Shawna M. Liff | 2025-06-10 |
| 12224261 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda | 2025-02-11 |
| 12205915 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Sergio Antonio Chan Arguedas, Chandra Mohan Jha | 2025-01-21 |