| 12432948 |
Compositional engineering of Schottky diode |
Arnab Sen Gupta, Urusa Alaan, Justin R. Weber, Charles C. Kuo, Yu-Jin Chen +5 more |
2025-09-30 |
| 12432897 |
Cooling approaches for stitched dies |
Wilfred Gomes, Christopher M. Pelto, Mark C. Phillips, Swaminathan Sivakumar |
2025-09-30 |
| 12426247 |
Capacitor connections in dielectric layers |
Travis W. Lajoie, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang, Jack T. Kavalieros +13 more |
2025-09-23 |
| 12412835 |
Back-side power delivery with glass support at the front |
Wilfred Gomes, Telesphor Kamgaing |
2025-09-09 |
| 12406956 |
Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers |
Van H. Le, Kimin Jun, Wilfred Gomes, Hui Jae Yoo |
2025-09-02 |
| 12402401 |
Integrated circuit devices with FinFETs over gate-all-around transistors |
Prashant Majhi, Brian S. Doyle, Van H. Le |
2025-08-26 |
| 12400997 |
Hybrid manufacturing with modified via-last process |
Wilfred Gomes, Mauro J. Kobrinsky, Doug B. Ingerly, Van H. Le |
2025-08-26 |
| 12396155 |
Backend memory with air gaps in upper metal layers |
Albert Chen, Wilfred Gomes, Fatih Hamzaoglu, Travis W. Lajoie, Van H. Le +3 more |
2025-08-19 |
| 12381193 |
Integrated circuit assemblies |
Wilfred Gomes, Van H. Le, Doug B. Ingerly |
2025-08-05 |
| 12374666 |
Integrated circuit assemblies with stacked compute logic and memory dies |
Prashant Majhi, Brian S. Doyle, Van H. Le |
2025-07-29 |
| 12376342 |
Passivation layers for thin film transistors |
Arnab Sen Gupta, Travis W. Lajoie, Sarah Atanasov, Chieh-Jen Ku, Bernhard Sell +5 more |
2025-07-29 |
| 12349416 |
Transistor structures with a metal oxide contact buffer and a method of fabricating the transistor structures |
Gilbert Dewey, Van H. Le, Jack T. Kavalieros, Shriram Shivaraman, Seung Hoon Sung +4 more |
2025-07-01 |
| 12342551 |
Capacitor architectures in semiconductor devices |
Sudipto Naskar, Manish Chandhok, Roman Caudillo, Scott B. Clendenning, Cheyun Lin |
2025-06-24 |
| 12327581 |
Embedded memory IC's with power supply droop circuitry coupled to ferroelectric capacitors |
Wilfred Gomes, Uygar E. Avci |
2025-06-10 |
| 12327809 |
Vertically stacked and bonded memory arrays |
Wilfred Gomes, Mauro J. Kobrinsky |
2025-06-10 |
| 12328864 |
3D 1T1C stacked dram structure and method to fabricate |
Aaron D. Lilak, Sean T. Ma |
2025-06-10 |
| 12328946 |
ESD protection decoupled from diffusion |
Urusa Alaan, Charles C. Kuo, Benjamin Orr, Nicholas A. Thomson, Ayan Kar +6 more |
2025-06-10 |
| 12310032 |
Stacked backend memory with resistive switching devices |
Wilfred Gomes, Van H. Le, Hui Jae Yoo |
2025-05-20 |
| 12302643 |
Backend electrostatic discharge diode apparatus and method of fabricating the same |
Prashant Majhi, Ilya V. Karpov, Brian S. Doyle, Ravi Pillarisetty |
2025-05-13 |
| 12278229 |
Hybrid manufacturing for integrated circuit devices and assemblies |
Wilfred Gomes, Mauro J. Kobrinsky, Doug B. Ingerly |
2025-04-15 |
| 12271306 |
Integrated three-dimensional (3D) DRAM cache |
Wilfred Gomes, Adrian C. Moga |
2025-04-08 |
| 12238913 |
Two transistor memory cell using stacked thin-film transistors |
Juan G. Alzate-Vinasco, Fatih Hamzaoglu, Bernhard Sell, Pei-Hua Wang, Van H. Le +5 more |
2025-02-25 |
| 12211794 |
Integrated circuits and methods for forming thin film crystal layers |
Carl Naylor, Ashish Agrawal, Kevin Lin, Mauro J. Kobrinsky, Christopher J. Jezewski +1 more |
2025-01-28 |
| 12197007 |
Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layer |
Wilfred Gomes |
2025-01-14 |
| 12191395 |
Dual gate control for trench shaped thin film transistors |
Van H. Le, Gilbert Dewey, Jack T. Kavalieros, Shriram Shivaraman, Benjamin Chu-Kung +2 more |
2025-01-07 |