| 12406956 |
Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers |
Abhishek A. Sharma, Van H. Le, Kimin Jun, Wilfred Gomes |
2025-09-02 |
| 12396155 |
Backend memory with air gaps in upper metal layers |
Abhishek A. Sharma, Albert Chen, Wilfred Gomes, Fatih Hamzaoglu, Travis W. Lajoie +3 more |
2025-08-19 |
| 12376342 |
Passivation layers for thin film transistors |
Abhishek A. Sharma, Arnab Sen Gupta, Travis W. Lajoie, Sarah Atanasov, Chieh-Jen Ku +5 more |
2025-07-29 |
| 12310032 |
Stacked backend memory with resistive switching devices |
Wilfred Gomes, Abhishek A. Sharma, Van H. Le |
2025-05-20 |
| 12300537 |
Conformal low temperature hermetic dielectric diffusion barriers |
Sean King, Sreenivas Kosaraju, Timothy E. Glassman |
2025-05-13 |
| 12266568 |
Interconnect wires including relatively low resistivity cores |
Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke |
2025-04-01 |
| 12255137 |
Sideways vias in isolation areas to contact interior layers in stacked devices |
Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +3 more |
2025-03-18 |
| 12224202 |
Forming an oxide volume within a fin |
Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more |
2025-02-11 |