Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12413001 | Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package | Zhichao Zhang, Zhe Chen, Steven A. Klein, Feifei Cheng, Srikant Nekkanty +2 more | 2025-09-09 |
| 12347788 | Glass substrates having signal shielding for use with semiconductor packages and related methods | Kristof Darmawikarta, Srinivas V. Pietambaram, Telesphor Kamgaing, Zhiguo Qian, Jiwei Sun | 2025-07-01 |
| 12313890 | Through-substrate optical vias | Pooya Tadayon, Zhichao Zhang, Brandon C. Marin, Tarek A. Ibrahim, Stephen Andrew Smith | 2025-05-27 |