Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12379769 | System, apparatus and method for dynamic thermal distribution of a system on chip | Rolf Kuehnis, Matthew Long | 2025-08-05 |
| 12327775 | Thermal performance in hybrid bonded 3D die stacks | Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov | 2025-06-10 |
| 12242315 | Thermal management in horizontally or vertically stacked dies | Somvir Dahiya, Stephen H. Gunther, Randy B. Osborne, Scot Kellar, Joshua Een | 2025-03-04 |