Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen +4 more | 2025-09-02 |
| 12315794 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Gerald Pasdast | 2025-05-27 |
| 12288746 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Gerald Pasdast | 2025-04-29 |