Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349282 | Capacitors in through glass vias | Benjamin Duong, Aleksandar Aleksov, Helme A. CASTRO DE LA TORRE, Kristof Darmawikarta, Darko Grujicic +5 more | 2025-07-01 |
| 12334422 | Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates | Kyle McElhinny, Onur Ozkan, Ali Lehaf, Xiaoying Guo, Steve Cho +4 more | 2025-06-17 |