Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191161 | Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors | Jeremy Ecton, Oscar Ojeda | 2025-01-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191161 | Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors | Jeremy Ecton, Oscar Ojeda | 2025-01-07 |