Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191161 | Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors | Oladeji Fadayomi, Jeremy Ecton | 2025-01-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191161 | Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors | Oladeji Fadayomi, Jeremy Ecton | 2025-01-07 |