Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12482779 | Hybrid backside thermal structures for enhanced ic packages | Feras Eid, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala | 2025-11-25 |
| 12341281 | Micro socket electrical couplings for dies | Srikant Nekkanty, Debendra Mallik, Saikumar Jayaraman, Feroz Mohammad | 2025-06-24 |