Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817390 | Microelectronic component having molded regions with through-mold vias | Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-11-14 |
| 11804426 | Integrated circuit structures in package substrates | William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2023-10-31 |
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2023-09-12 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2023-07-04 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-05-02 |
| 11581287 | Chip scale thin 3D die stacked package | Robert L. Sankman, Bernd Waidhas, Thomas Wagner, Lizabeth Keser | 2023-02-14 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11552035 | Electronic package with stud bump electrical connections | Zhaozhi Li, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2023-01-10 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Debendra Mallik, Robert L. Sankman | 2023-01-03 |