Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830809 | Magnetic structures in integrated circuit package supports | Ying Wang, Yikang Deng, Junnan Zhao, Cheng Xu, Kaladhar Radhakrishnan | 2023-11-28 |
| 11824013 | Package substrate with reduced interconnect stress | Lauren A. Link, Sheng Li, Sandeep B. Sane | 2023-11-21 |
| 11804455 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee | 2023-10-31 |
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Yikang Deng | 2023-09-26 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Rahul Jain, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong | 2023-08-22 |
| 11705389 | Vias for package substrates | Luke Garner, Liwei Cheng, Lauren A. Link, Cheng Xu, Ying Wang +2 more | 2023-07-18 |
| 11670504 | Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives | Jeremy Ecton, Brandon C. Marin, Dilan Seneviratne | 2023-06-06 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Rahul Jain, Prithwish Chatterjee, Sai Vadlamani, Lauren A. Link | 2023-05-16 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Gang Duan, Jeremy Ecton +1 more | 2023-04-04 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li +1 more | 2023-03-21 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Prithwish Chatterjee, Sai Vadlamani, Ying Wang, Chong Zhang | 2023-01-10 |
| 11552010 | Dielectric for high density substrate interconnects | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta | 2023-01-10 |