Issued Patents 2022
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515170 | 3D NAND etch | Shishi Jiang, Pramit Manna, Bo Qi, Rui Cheng, Tomohiko Kitajima +2 more | 2022-11-29 |
| 11515163 | Low temperature graphene growth | Jialiang Wang, Susmit Singha Roy, Nitin K. Ingle | 2022-11-29 |
| 11515149 | Deposition of flowable silicon-containing films | Lakmal C. Kalutarage, Mark Saly, David Thompson, Tejasvi Ashok, Pramit Manna | 2022-11-29 |
| 11495454 | Deposition of low-stress boron-containing layers | Huiyuan Wang, Rick Kustra, Bo Qi, Kaushik Alayavalli, Jay D. Pinson, II | 2022-11-08 |
| 11488856 | Methods for gapfill in high aspect ratio structures | Pramit Manna, Ludovic Godet, Rui Cheng, Erica Chen, Ziqing Duan +1 more | 2022-11-01 |
| 11469097 | Carbon hard masks for patterning applications and methods related thereto | Eswaranand Venkatasubramanian, Yang Yang, Pramit Manna, Kartik Ramaswamy, Takehito Koshizawa | 2022-10-11 |
| 11462438 | Volumetric expansion of metal-containing films by silicidation | Susmit Singha Roy, Srinivas Gandikota, Amrita B. Mullick | 2022-10-04 |
| 11462630 | Conformal halogen doping in 3D structures using conformal dopant film deposition | Rui Cheng, Yi Yang, Karthik Janakiraman | 2022-10-04 |
| 11430655 | Low temperature high-quality dielectric films | Eswaranand Venkatasubramanian, Samuel E. Gottheim, Pramit Manna | 2022-08-30 |
| 11414751 | Self-aligned structures from sub-oxides | Srinivas Gandikota, Susmit Singha Roy | 2022-08-16 |
| 11404263 | Deposition of low-stress carbon-containing layers | Huiyuan Wang, Rick Kustra, Bo Qi, Kaushik Alayavalli, Jay D. Pinson, II | 2022-08-02 |
| 11361991 | Method for Si gap fill by PECVD | Xin Liu, Fei Wang, Rui Cheng, Robert Jan Visser | 2022-06-14 |
| 11355354 | Thermal deposition of doped silicon oxide | Zeqing Shen, Bo Qi, Nitin K. Ingle | 2022-06-07 |
| 11335690 | Multicolor approach to DRAM STI active cut patterning | Tejinder Singh, Takehito Koshizawa, Pramit Manna, Nancy Fung, Eswaranand Venkatasubramanian +2 more | 2022-05-17 |
| 11332376 | Diamond-like carbon film | Eswaranand Venkatasubramanian, Samuel E. Gottheim, Pramit Manna | 2022-05-17 |
| 11328928 | Conformal high concentration boron doping of semiconductors | Srinivas Gandikota, Swaminathan Srinivasan, Rui Cheng, Susmit Singha Roy, Gaurav Thareja +2 more | 2022-05-10 |
| 11315943 | Bottom-up approach to high aspect ratio hole formation in 3D memory structures | Praburam Gopalraja, Susmit Singha Roy, Srinivas Gandikota | 2022-04-26 |
| 11276573 | Methods of forming high boron-content hard mask materials | Bo Qi, Zeqing Shen | 2022-03-15 |
| 11270905 | Modulating film properties by optimizing plasma coupling materials | Eswaranand Venkatasubramanian, Edward Haywood, Samuel E. Gottheim, Pramit Manna, Kien N. Chuc +2 more | 2022-03-08 |
| 11244824 | Conformal doped amorphous silicon as nucleation layer for metal deposition | Rui Cheng, Yihong Chen, Yong Wu, Srinivas Gandikota | 2022-02-08 |
| 11236418 | Bottom-up growth of silicon oxide and silicon nitride using sequential deposition-etch-treat processing | Rui Cheng, Pramit Manna | 2022-02-01 |
| 11232955 | Methods of etching metal oxides with less etch residue | Amrita B. Mullick, Srinivas Gandikota, Susmit Singha Roy, Yingli Rao, Regina Freed +1 more | 2022-01-25 |
| 11227797 | Film deposition using enhanced diffusion process | Shishi Jiang, Kurtis Leschkies, Pramit Manna | 2022-01-18 |
| 11217443 | Sequential deposition and high frequency plasma treatment of deposited film on patterned and un-patterned substrates | Vinayak Veer Vats, Hang Yu, Philip Allan Kraus, Sanjay Kamath, William J. Durand +6 more | 2022-01-04 |