Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495454 | Deposition of low-stress boron-containing layers | Huiyuan Wang, Rick Kustra, Bo Qi, Abhijit Basu Mallick, Jay D. Pinson, II | 2022-11-08 |
| 11404263 | Deposition of low-stress carbon-containing layers | Huiyuan Wang, Rick Kustra, Bo Qi, Abhijit Basu Mallick, Jay D. Pinson, II | 2022-08-02 |