RK

Rick Kustra

Applied Materials: 2 patents #366 of 1,508Top 25%
Overall (2022): #118,306 of 548,613Top 25%
2
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11495454 Deposition of low-stress boron-containing layers Huiyuan Wang, Bo Qi, Abhijit Basu Mallick, Kaushik Alayavalli, Jay D. Pinson, II 2022-11-08
11404263 Deposition of low-stress carbon-containing layers Huiyuan Wang, Bo Qi, Abhijit Basu Mallick, Kaushik Alayavalli, Jay D. Pinson, II 2022-08-02