Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538677 | Systems and methods for depositing high density and high tensile stress films | Chuanxi Yang, Hang Yu, Yu-Chi Yang, Chuan Ying Wang, Allison Yau +2 more | 2022-12-27 |
| 11430654 | Initiation modulation for plasma deposition | Madhu Santosh Kumar Mutyala, Deenesh Padhi | 2022-08-30 |
| 11270903 | Multi zone electrostatic chuck | Madhu Santosh Kumar Mutyala, Deenesh Padhi | 2022-03-08 |
| 11217443 | Sequential deposition and high frequency plasma treatment of deposited film on patterned and un-patterned substrates | Vinayak Veer Vats, Hang Yu, Philip Allan Kraus, William J. Durand, Lakmal C. Kalutarage +6 more | 2022-01-04 |