Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538677 | Systems and methods for depositing high density and high tensile stress films | Chuanxi Yang, Hang Yu, Yu-Chi Yang, Allison Yau, Xinhai Han +2 more | 2022-12-27 |
| 11501993 | Semiconductor substrate supports with improved high temperature chucking | Jian Li, Juan Carlos Rocha-Alvarez, Zheng John Ye, Daemian Raj Benjamin Raj, Shailendra Srivastava +3 more | 2022-11-15 |