Issued Patents All Time
Showing 151–175 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355964 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2016-05-31 |
| 9349768 | CMOS image sensor with epitaxial passivation layer | Yu-Hung Cheng, Tung-Hsiung Tseng, Cheng-Ta Wu, Chia-Shiung Tsai, Ru-Liang Lee +4 more | 2016-05-24 |
| 9337225 | Semiconductor device and manufacturing method thereof | Hung-Wen Hsu, Jung-I Lin, Ching-Chung Su, Jiech-Fun Lu, Chia-Shiung Tsai | 2016-05-10 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Xin-Hua Huang, Chih-Hui Huang, Lan-Lin Chao, Yan-Chih Lu +2 more | 2016-05-03 |
| 9324668 | Bonding structures and methods of forming the same | Luan C. Tran, Ching-Chun Wang | 2016-04-26 |
| 9293392 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Lin Chia-Chieh +4 more | 2016-03-22 |
| 9281331 | High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor | Sheng-Chau Chen, Chih-Yu Lai, Kuo-Ming Wu, Kuo-Hwa Tzeng, Cheng-Hsien Chou +2 more | 2016-03-08 |
| 9257399 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao +2 more | 2016-02-09 |
| 9252296 | Semiconductor device with compressive layers | Chun-Han Tsao, Chih-Yu Lai, Chih-Hui Huang, Cheng-Ta Wu, Ching-Chun Wang +2 more | 2016-02-02 |
| 9245974 | Performance boost by silicon epitaxy | Yu-Hung Cheng, Cheng-Ta Wu, Chia-Shiung Tsai, Ru-Liang Lee, Tung-I Lin +1 more | 2016-01-26 |
| 9190441 | Image sensor trench isolation with conformal doping | Chih-Yu Lai, Chih-Hui Huang, Cheng-Ta Wu, Chia-Shiung Tsai, Luan C. Tran | 2015-11-17 |
| 9153717 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Yen-Chang Chu, Cheng-Ta Wu, Chia-Shiung Tsai, Xiaomeng Chen | 2015-10-06 |
| 9147710 | Photodiode gate dielectric protection layer | Cheng-Hsien Chou, Wen-I Hsu, Tsun-Kai Tsao, Chih-Yu Lai, Jiech-Fun Lu | 2015-09-29 |
| 9142517 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang +3 more | 2015-09-22 |
| 9105485 | Bonding structures and methods of forming the same | Luan C. Tran, Ching-Chun Wang | 2015-08-11 |
| 9099389 | Method and apparatus for reducing stripe patterns | Chung Chien Wang, Cheng-Ta Wu, Chia-Shiung Tsai | 2015-08-04 |
| 9099324 | Semiconductor device with trench isolation | Yu-Hung Cheng, Cheng-Ta Wu, Chia-Shiung Tsai, Ru-Liang Lee, Tung-I Lin +1 more | 2015-08-04 |
| 9059057 | Image sensor having compressive layers | Chun-Han Tsao, Chih-Yu Lai, Chih-Hui Huang, Cheng-Ta Wu, Ching-Chun Wang +2 more | 2015-06-16 |
| 9040385 | Mechanisms for cleaning substrate surface for hybrid bonding | Sheng-Chau Chen, Chih-Hui Huang, Cheng-Ta Wu, Chia-Shiung Tsai, Xiao-Meng Chen | 2015-05-26 |
| 9006080 | Varied STI liners for isolation structures in image sensing devices | Cheng-Hsien Chou, Min-Feng Kao, Feng-Chi Hung, Shih Pei Chou, Jiech-Fun Lu +1 more | 2015-04-14 |
| 8932900 | Phase change memory and method of fabricating same | Tsun-Kai Tsao, Ming-Huei Shen, Shih-Chang Liu, Chia-Shiung Tsai | 2015-01-13 |
| 8889460 | Sidewall for backside illuminated image sensor metal grid and method of manufacturing same | Hung-Wen Hsu, Shih-Chang Liu | 2014-11-18 |
| 8889507 | MIM capacitors with improved reliability | Chih-Ta Wu, Jason Lee, Chung Chien Wang, Hsing-Lien Lin, Yu-Jen Wang +7 more | 2014-11-18 |
| 8883524 | Methods and apparatus for CMOS sensors | Chun-Tsung Kuo, Jiech-Fun Lu, Chia-Shiung Tsai | 2014-11-11 |
| 8851133 | Method and apparatus of holding a device | Martin Liu, Chung-Yi Yu, Che Ying Hsu, Da-Hsiang Chou, Chia-Shiung Tsai | 2014-10-07 |