Issued Patents All Time
Showing 201–225 of 292 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269589 | Method of manufacturing a release film as isolation film in package | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Jing-Cheng Lin | 2019-04-23 |
| 10269730 | Methods of manufacturing an integrated circuit having stress tuning layer | Shin-Puu Jeng, Clinton Chao | 2019-04-23 |
| 10269731 | Apparatus for dicing interposer assembly | Chung Yu Wang, Kung-Chen Yeh, Chih-Wei Wu, Jing-Cheng Lin | 2019-04-23 |
| 10170441 | Semiconductor structure and manufacturing method thereof | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin | 2019-01-01 |
| 10170295 | Flux residue cleaning system and method | I-Ting Chen, Jing-Cheng Lin, Ying-Ching Shih | 2019-01-01 |
| 10163817 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Jing-Cheng Lin, Chen-Hua Yu, Yen-Yao Chi | 2018-12-25 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo, Long Hua Lee +2 more | 2018-12-18 |
| 10157888 | Integrated fan-out packages and methods of forming the same | Jing-Cheng Lin, Tsung-Fu Tsai, Chen-Hua Yu, Po-Hao Tsai, Shih-Ting Lin +2 more | 2018-12-18 |
| 10157850 | Semiconductor packages and manufacturing method thereof | Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2018-12-18 |
| 10157870 | Integrated fan-out package and method of fabricating the same | Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2018-12-18 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2018-12-11 |
| 10115650 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Jing-Cheng Lin | 2018-10-30 |
| 10090253 | Semiconductor package | Jing-Cheng Lin, Po-Hao Tsai, Ying-Ching Shih | 2018-10-02 |
| 10032662 | Packaged semiconductor devices and packaging methods thereof | Shu-Hang Liao, Ying-Ching Shih, Jing-Cheng Lin | 2018-07-24 |
| 9947629 | Method of forming contact holes in a fan out package | Feng-Cheng Hsu, Jing-Cheng Lin | 2018-04-17 |
| 9929109 | Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin | 2018-03-27 |
| 9895871 | De-bonding and cleaning process and system | Ying-Ching Shih, Jing-Cheng Lin | 2018-02-20 |
| 9859181 | Underfill dispensing in 3D IC using metrology | Jing-Cheng Lin, I-Hsuan Peng | 2018-01-02 |
| 9847315 | Packages, packaging methods, and packaged semiconductor devices | Shih-Ting Lin, Jui-Pin Hung, Jing-Cheng Lin | 2017-12-19 |
| 9831224 | Solution for reducing poor contact in info packages | Jing-Cheng Lin, Chen-Hua Yu, Shih-Ting Lin, Shin-Puu Jeng | 2017-11-28 |
| 9818697 | Semiconductor package manufacturing method | Jing-Cheng Lin, Po-Hao Tsai, Ying-Ching Shih | 2017-11-14 |
| 9793187 | 3D packages and methods for forming the same | Shih-Ting Lin, Kung-Chen Yeh, Jing-Cheng Lin | 2017-10-17 |
| 9773724 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Jing-Cheng Lin | 2017-09-26 |
| 9704825 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2017-07-11 |
| 9679783 | Molding wafer chamber | Jing-Cheng Lin, Chin-Chuan Chang, Jui-Pin Hung, Shin-Puu Jeng, Chen-Hua Yu | 2017-06-13 |