Issued Patents All Time
Showing 151–175 of 292 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094639 | Semiconductor package | Jing-Cheng Lin, Po-Hao Tsai, Ying-Ching Shih | 2021-08-17 |
| 11094635 | Package structure and method for forming the same | Chin-Chuan Chang | 2021-08-17 |
| 11088086 | Chip package structure and method for forming the same | Jiun-Ting Chen, Ying-Ching Shih, Chih-Wei Wu | 2021-08-10 |
| 11081369 | Package structure and manufacturing method thereof | Li-Hui Cheng, Ping-Yin Hsieh, Chih-Hao Chen | 2021-08-03 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee +1 more | 2021-07-27 |
| 11062968 | Package structure and method for forming the same | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2021-07-13 |
| 11056436 | Integrated fan-out structure with rugged interconnect | Shih-Ting Lin, Jing-Cheng Lin, Chen-Hua Yu | 2021-07-06 |
| 11056364 | Method for substrate thinning | Yi-Chao Mao, Chin-Chuan Chang | 2021-07-06 |
| 11031381 | Optical transceiver and manufacturing method thereof | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2021-06-08 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Li-Chung Kuo, Long Hua Lee, Ying-Ching Shih, Kuan-Yu Huang | 2021-06-01 |
| 10985140 | Structure and formation method of package structure with underfill | Chen-Hsuan Tsai, Tsung-Fu Tsai, Shih-Ting Lin | 2021-04-20 |
| 10964609 | Apparatus and method for detecting end point | Yi-Chao Mao, Chin-Chuan Chang | 2021-03-30 |
| 10957616 | Package structure and method | Jing-Cheng Lin, Chen-Hua Yu | 2021-03-23 |
| 10943873 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Jing-Cheng Lin, Chen-Hua Yu, Yen-Yao Chi | 2021-03-09 |
| 10923438 | Package structure and method for forming the same | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin | 2021-02-16 |
| 10916488 | Semiconductor package having thermal conductive pattern surrounding the semiconductor die | Jing-Cheng Lin | 2021-02-09 |
| 10916450 | Package of integrated circuits having a light-to-heat-conversion coating material | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Jing-Cheng Lin | 2021-02-09 |
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo +3 more | 2020-12-29 |
| 10867962 | Packaging process and manufacturing method | Jiun-Ting Chen, Chih-Wei Wu, Ying-Ching Shih | 2020-12-15 |
| 10867955 | Package structure having adhesive layer surrounded dam structure | Li-Hui Cheng, Chin-Fu Kao, Chih-Yuan Chien | 2020-12-15 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin +1 more | 2020-12-15 |
| 10867849 | Package-on-package structure | Li-Hui Cheng, Chin-Fu Kao, Chih-Yuan Chien | 2020-12-15 |
| 10867919 | Electronic device and manufacturing method thereof | Tsung-Fu Tsai, Hou-Ju Huang, Shih-Ting Lin, Hung-Wei Tsai | 2020-12-15 |
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Kung-Chen Yeh | 2020-12-08 |
| 10861835 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Chen-Hua Yu, Shih-Ting Lin, Shin-Puu Jeng | 2020-12-08 |