Issued Patents All Time
Showing 176–200 of 292 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10852476 | Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2020-12-01 |
| 10840215 | Sawing underfill in packaging processes | Ying-Da Wang, Li-Chung Kuo, Jing-Cheng Lin | 2020-11-17 |
| 10818583 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Jing-Cheng Lin | 2020-10-27 |
| 10804178 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Ying-Ching Shih | 2020-10-13 |
| 10796976 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng | 2020-10-06 |
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2020-09-08 |
| 10756058 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Chih-Wei Wu | 2020-08-25 |
| 10741467 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Jing-Cheng Lin | 2020-08-11 |
| 10679915 | Package structure and manufacturing method thereof | Ping-Yin Hsieh, Chin-Fu Kao, Li-Hui Cheng | 2020-06-09 |
| 10672631 | Method and system for substrate thinning | Yi-Chao Mao, Chin-Chuan Chang | 2020-06-02 |
| 10586763 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Ying-Ching Shih | 2020-03-10 |
| 10529690 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin +1 more | 2020-01-07 |
| 10529637 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Ying-Ching Shih | 2020-01-07 |
| 10510732 | PoP device and method of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Ying-Ching Shih | 2019-12-17 |
| 10510684 | Three dimensional integrated circuit (3DIC) with support structures | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin | 2019-12-17 |
| 10510634 | Package structure and method | Jing-Cheng Lin, Chen-Hua Yu | 2019-12-17 |
| 10510595 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee | 2019-12-17 |
| 10510591 | Package-on-package structure and method of manufacturing package | Li-Hui Cheng, Chin-Fu Kao, Chih-Yuan Chien | 2019-12-17 |
| 10504824 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2019-12-10 |
| 10497690 | Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Jing-Cheng Lin | 2019-12-03 |
| 10490474 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Jing-Cheng Lin | 2019-11-26 |
| 10483234 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2019-11-19 |
| 10438934 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Chin-Fu Kao, Jing-Cheng Lin, Li-Hui Cheng | 2019-10-08 |
| 10347612 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Chen-Hua Yu, Shih-Ting Lin, Shin-Puu Jeng | 2019-07-09 |
| 10340253 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2019-07-02 |