Issued Patents All Time
Showing 276–300 of 350 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361139 | Semicondcutor package and manufacturing method thereof | Shih-Hao Tseng, Ming-Che Ho, Chia-Hung Liu | 2019-07-23 |
| 10340206 | Dense redistribution layers in semiconductor packages and methods of forming the same | Chen-Hua Yu, Hui-Jung Tsai | 2019-07-02 |
| 10332856 | Package structure and method of fabricating the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang | 2019-06-25 |
| 10304700 | Semiconductor device and method | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Chen-Cheng Kuo +3 more | 2019-05-28 |
| 10297544 | Integrated fan-out package and method of fabricating the same | Yi-Wen Wu, Ming-Che Ho | 2019-05-21 |
| 10297551 | Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package | Hui-Jung Tsai, Yun Chen Hsieh | 2019-05-21 |
| 10297560 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Yi-Wen Wu, Tzung-Hui Lee | 2019-05-21 |
| 10283461 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2019-05-07 |
| 10276402 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hui-Jung Tsai +1 more | 2019-04-30 |
| 10276421 | Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages | Sih-Hao Liao, Yu-Hsiang Hu | 2019-04-30 |
| 10276428 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Chen-Cheng Kuo | 2019-04-30 |
| 10276543 | Semicondcutor device package and method of forming semicondcutor device package | Sih-Hao Liao, Yu-Hsiang Hu | 2019-04-30 |
| 10269675 | Conductive line system and process | Yu Yi Huang, Chung-Shi Liu | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2019-04-23 |
| 10269747 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yi-Yang Lei, Szu-Yu Yeh, Yu-Ren Chen, Chung-Shi Liu | 2019-04-23 |
| 10204870 | Semiconductor device and method of manufacturing the same | Zi-Jheng Liu, Jo-Lin Lan, Yu-Hsiang Hu | 2019-02-12 |
| 10177105 | Semiconductor structure and method of forming | Chen-Hua Yu, Yu-Hsiang Hu | 2019-01-08 |
| 10163858 | Semiconductor packages and manufacturing methods thereof | Zi-Jheng Liu, Chen-Cheng Kuo | 2018-12-25 |
| 10153240 | Method of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Kai-Chiang Wu | 2018-12-11 |
| 10134700 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2018-11-20 |
| 10134699 | Packages with solder ball revealed through layer | Yu-Hsiang Hu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-11-20 |
| 10128206 | Conductive pillar structure | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Meng-Wei Chou, Chung-Shi Liu | 2018-11-13 |
| 10090194 | Semiconductor device and method | Zi-Jheng Liu, Yu-Hsiang Hu | 2018-10-02 |
| 10074623 | Method of fabricating redistribution circuit structure | Tzung-Hui Lee, Ming-Che Ho, Tzu-Yun Huang | 2018-09-11 |
| 10068853 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Yi-Wen Wu | 2018-09-04 |