Issued Patents All Time
Showing 301–325 of 350 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Chung-Shi Liu +1 more | 2018-08-14 |
| 10049986 | Package structures and methods of making the same | Zi-Jheng Liu, Chung-Shi Liu, Yu-Hsiang Hu | 2018-08-14 |
| 10032735 | Semiconductor structure and method of forming | Chen-Hua Yu, Yu-Hsiang Hu | 2018-07-24 |
| 9935047 | Bonding structures and methods forming the same | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Alexander Kalnitsky, Ming-Che Ho +3 more | 2018-04-03 |
| 9899342 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Tzung-Hui Lee, Ming-Che Ho, Tzu-Yun Huang | 2018-02-20 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng, Yu-Hsiang Hu | 2018-02-20 |
| 9871009 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Yi-Wen Wu, Tzung-Hui Lee | 2018-01-16 |
| 9859206 | Photoactive compound gradient photoresist | Chen-Hua Yu, Chung-Shi Liu | 2018-01-02 |
| 9842790 | Conductive line system and process | Yu Yi Huang, Chung-Shi Liu | 2017-12-12 |
| 9837278 | Wafer level chip scale package and method of manufacturing the same | Yu-Hsiang Hu, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-12-05 |
| 9793230 | Semiconductor structure and method of forming | Chen-Hua Yu, Yu-Hsiang Hu | 2017-10-17 |
| 9793140 | Staggered via redistribution layer (RDL) for a package and a method for forming the same | Chen-Hua Yu, Chung-Shi Liu | 2017-10-17 |
| 9786617 | Chip packages and methods of manufacture thereof | Zi-Jheng Liu, Chen-Cheng Kuo, Chung-Shi Liu, Yu-Hsiang Hu | 2017-10-10 |
| 9765289 | Cleaning methods and compositions | Hui-Jung Tsai, Chung-Shi Liu | 2017-09-19 |
| 9741586 | Method of fabricating package structures | Yu-Hsiang Hu, Chung-Shi Liu, Sih-Hao Liao | 2017-08-22 |
| 9659805 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Chung-Shi Liu, Ming-Da Cheng | 2017-05-23 |
| 9601355 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2017-03-21 |
| 9576874 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Chun-Lin Lu | 2017-02-21 |
| 9570413 | Packages with solder ball revealed through laser | Yu-Hsiang Hu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-02-14 |
| 9548283 | Package redistribution layer structure and method of forming same | Tsung-Shu Lin, Yi-Wen Wu | 2017-01-17 |
| 9502360 | Stress compensation layer for 3D packaging | Chun-Hung Lin, Yu-Feng Chen, Han-Ping Pu | 2016-11-22 |
| 9481746 | Modified high-cis isoprene polymer, method for producing the same, and tire containing aforementioned polymer | Chih-Cheng Lee | 2016-11-01 |
| 9478511 | Methods and apparatus of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Kai-Chiang Wu | 2016-10-25 |
| 9431342 | Staggered via redistribution layer (RDL) for a package and a method for forming the same | Chen-Hua Yu, Chung-Shi Liu | 2016-08-30 |
| 9430605 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang +1 more | 2016-08-30 |