Issued Patents All Time
Showing 251–275 of 350 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685896 | Integrated circuit package and method of fabricating the same | Zi-Jheng Liu, Yu-Hsiang Hu | 2020-06-16 |
| 10665545 | Semiconductor devices, semiconductor packages and methods of forming the same | Sih-Hao Liao, Yu-Hsiang Hu, Meng-Che Tu | 2020-05-26 |
| 10658287 | Semiconductor device having a tapered protruding pillar portion | Sih-Hao Liao, Yu-Hsiang Hu | 2020-05-19 |
| 10658208 | Polyimide composition for package structure, package structure and method of fabricating the same | Sih-Hao Liao, Yu-Hsiang Hu | 2020-05-19 |
| 10658199 | Semiconductor device and method | Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2020-05-19 |
| 10643916 | Conductive line system and process | Yu Yi Huang, Chung-Shi Liu | 2020-05-05 |
| 10629540 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2020-04-21 |
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2020-04-21 |
| 10622321 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Hui-Jung Tsai, Tsao-Lun Chang | 2020-04-14 |
| 10607941 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu | 2020-03-31 |
| 10529675 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2020-01-07 |
| 10529593 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Po-Han Wang, Yu-Hsiang Hu | 2020-01-07 |
| 10522501 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2019-12-31 |
| 10522440 | Package structure and method of manufacturing the same | Po-Han Wang, Yu-Hsiang Hu | 2019-12-31 |
| 10515848 | Semiconductor package and method | Yun Chen Hsieh, Hui-Jung Tsai | 2019-12-24 |
| 10510698 | Semiconductor structure and method of forming | Chen-Hua Yu, Yu-Hsiang Hu | 2019-12-17 |
| 10510645 | Planarizing RDLs in RDL-first processes through CMP process | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2019-12-17 |
| 10510646 | Packae structure, RDL structure and method of forming the same | Tzung-Hui Lee, Ming-Che Ho | 2019-12-17 |
| 10510673 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Yi-Wen Wu | 2019-12-17 |
| 10510704 | Package structure and method of manufacturing the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao | 2019-12-17 |
| 10510706 | Package structure and method of fabricating the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang | 2019-12-17 |
| 10490521 | Advanced structure for info wafer warpage reduction | Yu-Hsiang Hu, Chung-Shi Liu | 2019-11-26 |
| 10461051 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2019-10-29 |
| 10446521 | Integrated fan-out package and method of fabricating an integrated fan-out package | Yu-Hsiang Hu, Sih-Hao Liao | 2019-10-15 |
| 10361122 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu | 2019-07-23 |