Issued Patents All Time
Showing 226–250 of 350 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867941 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Yi-Wen Wu, Tzung-Hui Lee | 2020-12-15 |
| 10867874 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Yun Chen Hsieh | 2020-12-15 |
| 10867827 | Alignment holder, testing apparatus and method for manufacturing a semiconductor package | Chih-Yu Wang, Hui-Jung Tsai | 2020-12-15 |
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2020-12-15 |
| 10867793 | Semiconductor package and method of fabricating the same | Zi-Jheng Liu, Ming-Che Ho, Ming-Tan Lee, Tzung-Hui Lee | 2020-12-15 |
| 10865496 | Plating apparatus and plating method | Tuan-Yu Hung, Ming-Che Ho | 2020-12-15 |
| 10861809 | Semiconductor structure and method of forming | Chen-Hua Yu, Yu-Hsiang Hu | 2020-12-08 |
| 10859922 | Lithography system and method | Chen-Hua Yu, Ming-Tan Lee | 2020-12-08 |
| 10861710 | Methods of manufacturing semiconductor devices | Ming-Tan Lee, Chen-Cheng Kuo, De-Yuan Lu | 2020-12-08 |
| 10861814 | Integrated fan-out packages and methods of forming the same | Tzung-Hui Lee, Chen-Hua Yu, Chi-Ming Tsai, Ming-Che Ho | 2020-12-08 |
| 10854569 | Package structure, semiconductor device and method of fabricating the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang | 2020-12-01 |
| 10854570 | Integrated fan-out package and method of fabricating the same | Hui-Jung Tsai, Jyun-Siang Peng | 2020-12-01 |
| 10847429 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Hui-Jung Tsai, Chih-Yu Wang | 2020-11-24 |
| 10840129 | Semiconductor package and method | Yun Chen Hsieh, Hui-Jung Tsai | 2020-11-17 |
| 10833053 | Semiconductor package and method of forming the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Hung-Chun Cho | 2020-11-10 |
| 10797023 | Integrated fan-out package and method of fabricating an integrated fan-out package | Yu-Hsiang Hu, Sih-Hao Liao | 2020-10-06 |
| 10790252 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yi-Yang Lei, Szu-Yu Yeh, Yu-Ren Chen, Chung-Shi Liu | 2020-09-29 |
| 10790212 | Method of manufacturing package structure | Po-Han Wang, Yu-Hsiang Hu | 2020-09-29 |
| 10763206 | Method of fabricating integrated fan-out packages | Po-Han Wang, Yu-Hsiang Hu | 2020-09-01 |
| 10734341 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2020-08-04 |
| 10714414 | Planarizing RDLS in RDL—First Processes Through CMP Process | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2020-07-14 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hui-Jung Tsai +1 more | 2020-07-07 |
| 10707084 | Method of manufacturing wafer level chip scale package | Yu-Hsiang Hu, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-07-07 |
| 10700001 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Alexander Kalnitsky, Ming-Che Ho +3 more | 2020-06-30 |
| 10692838 | Semiconductor packages | Zi-Jheng Liu, Chen-Cheng Kuo | 2020-06-23 |