Issued Patents All Time
Showing 326–350 of 350 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368402 | Conductive line system and process | Yu Yi Huang, Chung-Shi Liu | 2016-06-14 |
| 9362236 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Jimmy Liang, Ming-Che Ho, Chung-Shi Liu +1 more | 2016-06-07 |
| 9359462 | Modified high cis butadiene-isoprene copolymer, method for producing the same and tire having aforementioned polymer | Chih-Cheng Lee | 2016-06-07 |
| 9318429 | Integrated structure in wafer level package | Yu-Hsiang Hu, Chung-Shi Liu | 2016-04-19 |
| 9263302 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2016-02-16 |
| 9209140 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Chun-Lin Lu | 2015-12-08 |
| 9165885 | Staggered via redistribution layer (RDL) for a package and a method for forming the same | Chen-Hua Yu, Chung-Shi Liu | 2015-10-20 |
| 9117881 | Conductive line system and process | Yu Yi Huang, Chung-Shi Liu | 2015-08-25 |
| 9111064 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang +1 more | 2015-08-18 |
| 9082870 | Methods and apparatus of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Kai-Chiang Wu | 2015-07-14 |
| 8865585 | Method of forming post passivation interconnects | Meng-Wei Chou, Ming-Che Ho, Chung-Shi Liu | 2014-10-21 |
| 8853071 | Electrical connectors and methods for forming the same | Chun-Chieh Wang, Chung-Shi Liu | 2014-10-07 |
| 8835193 | Non-uniform alignment of wafer bumps with substrate solders | Chung-Shi Liu, Chen-Hua Yu | 2014-09-16 |
| 8791579 | Adjusting sizes of connectors of package components | Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang +1 more | 2014-07-29 |
| 8754508 | Structure to increase resistance to electromigration | Hsien-Wei Chen | 2014-06-17 |
| 8748306 | Cleaning residual molding compound on solder bumps | Yi-Yang Lei, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu | 2014-06-10 |
| 8647796 | Photoactive compound gradient photoresist | Chen-Hua Yu, Chung-Shi Liu | 2014-02-11 |
| 8501613 | UBM etching methods for eliminating undercut | Yi-Yang Lei, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu | 2013-08-06 |
| 8446007 | Non-uniform alignment of wafer bumps with substrate solders | Chung-Shi Liu, Chen-Hua Yu | 2013-05-21 |
| 8389397 | Method for reducing UBM undercut in metal bump structures | Yi-Yang Lei, Chung-Shi Liu | 2013-03-05 |
| 8373282 | Wafer level chip scale package with reduced stress on solder balls | Yu-Feng Chen, Yu-Ling Tsai, Han-Ping Pu, Yu Yi Huang | 2013-02-12 |
| 8237272 | Conductive pillar structure for semiconductor substrate and method of manufacture | Chung-Shi Liu, Chen-Hua Yu | 2012-08-07 |
| 8101340 | Method of inhibiting photoresist pattern collapse | Ching-Yu Chang, Heng-Jen Lee, Chin-Hsiang Lin, Hua-Tai Lin, Kuei-Shun Chen +4 more | 2012-01-24 |
| 6316152 | OPC method to improve e-beam writing time | Hong-Chang Hsieh, Shinn-Sheng Yu | 2001-11-13 |
| 6210841 | Approach to increase the resolution of dense line/space patterns for 0.18 micron and below design rules using attenuating phase shifting masks | Chia-Hui Lin | 2001-04-03 |