Issued Patents All Time
Showing 26–50 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368280 | Semiconductor device and method | An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh, Yu-Hung Lin +1 more | 2025-07-22 |
| 12368149 | Methods of forming semiconductor packages | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2025-07-22 |
| 12362315 | Heterogeneous dielectric bonding scheme | Wen-Chih Chiou, Ku-Feng Yang, Ming-Tsu Chung | 2025-07-15 |
| 12362262 | Semiconductor device including through die via | Kuo-Chung Yee | 2025-07-15 |
| 12362228 | Semiconductor package and method | Wei-Yu Chen, Jiun Yi Wu, Chung-Shi Liu, Chien-Hsun Lee | 2025-07-15 |
| 12356558 | Electronic assembly having circuit carrier | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2025-07-08 |
| 12354969 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu, Chien-Hsun Lee | 2025-07-08 |
| 12354926 | Package and method for manufacturing the same | Tin-Hao Kuo | 2025-07-08 |
| 12353134 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Ming-Tan Lee | 2025-07-08 |
| 12353011 | Photonic package and method of manufacture | Tsung-Fu Tsai, Hsing-Kuo Hsia, Szu-Wei Lu | 2025-07-08 |
| 12347791 | Integrated circuit package and method | Tzu-Yun Huang, Ming-Che Ho, Hung-Jui Kuo | 2025-07-01 |
| 12347785 | Semiconductor structure and method manufacturing the same | Kuo-Chung Yee | 2025-07-01 |
| 12345935 | Package assembly and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2025-07-01 |
| 12341106 | Package structure | Chun-Wen Lin, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu | 2025-06-24 |
| 12341079 | Package structure and manufacturing method thereof | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2025-06-24 |
| 12334446 | Semiconductor package and method | Jiun Yi Wu, Chung-Shi Liu | 2025-06-17 |
| 12334362 | Package structure including photonic package having embedded optical glue | Jiun Yi Wu | 2025-06-17 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2025-06-10 |
| 12327796 | Architecture for computing system package | Chieh-Yen Chen, Chuei-Tang Wang, Chung-Hao Tsai | 2025-06-10 |
| 12322705 | Chip package and manufacturing method thereof | Chuei-Tang Wang | 2025-06-03 |
| 12315784 | Semiconductor package and manufacturing method thereof | Hung-Yi Kuo, Cheng-Chieh Hsieh, Kuo-Chung Yee | 2025-05-27 |
| 12315854 | Integrated circuit package and method | Wei Ling Chang, Chuei-Tang Wang, Chieh-Yen Chen | 2025-05-27 |
| 12315831 | Package structure and manufacturing method thereof | Kuo-Chung Yee | 2025-05-27 |
| 12315819 | Method of forming RDLs and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Hui-Jung Tsai | 2025-05-27 |
| 12308343 | Semiconductor device and method of forming the same | Jiun Yi Wu, Shang-Yun Hou | 2025-05-20 |